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 LCD Panel Power, VCOM, and Gate Modulation
ADD8754
FEATURES
Step-up switching regulator with 2 A power switch 650 kHz or 1.2 MHz switching frequency Output adjustable to 20 V 350 mA logic voltage regulator Selectable output voltages: 2.5 V, 2.85 V, 3.3 V VCOM amplifier with 300 mA drive Gate pulse modulation circuitry Independently adjustable delay and falling slope General 3 V to 5.5 V input Undervoltage lockout Thermal shutdown 24-lead, Pb-free LFCSP package
FUNCTIONAL BLOCK DIAGRAM
COMP SS VIN_1 VIN_2
ADD8754
FB FREQ SHDN STEP-UP SWITCHING REGULATOR LX
UNDER VOLTAGE LOCKOUT AND THERMAL PROTECTION
LOGIC VOLTAGE REGULATOR
LDO_OUT ADJ
VDD_2 OUT VCOM AMPLIFIER
POS NEG
APPLICATIONS
TFT LCD panels for monitors, TVs, and notebooks
VGH
GATE PULSE MODULATION
05110-001
VGH_M VDD_1 CE RE VFLK
VDPM
Figure 1.
GENERAL DESCRIPTION
The ADD8754 is optimized for use in TFT LCD applications, requiring only external charge pump components to provide all the requirements for panel power, VCOM, and gate modulation. Included in a single chip are a high frequency step-up dc-to-dc switching regulator, logic voltage regulator, VCOM amplifier, and gate pulse modulation circuitry. The step-up dc-to-dc converter provides up to 20 V output and includes a 2 A internal switch. Either a 650 kHz or 1.2 MHz stepup switching regulator frequency can be chosen, allowing easy filtering and low noise operation. It achieves 93% efficiency and features soft start to limit the inrush current at startup. The internal voltage regulator operates with an input voltage range of 3 V to 5.5 V and delivers a load current of up to 350 mA. Three selectable output voltages are available: 2.5 V, 2.85 V, and 3.3 V. The proprietary VCOM amplifier can deliver a peak output current of 300 mA and is specifically designed to drive TFT panel loads. The gate pulse modulator allows shaping of the TFT gate high voltage to improve image quality. The integrated switches provide the ability to independently control the delay and slope for the gate drive voltage. The ADD8754 is offered in a 24-lead, Pb-free LFCSP package and is specified over the industrial temperature range of -40 to +85C.
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 (c)2005 Analog Devices, Inc. All rights reserved.
ADD8754 TABLE OF CONTENTS
Specifications..................................................................................... 3 Step-Up Switching Regulator Specifications............................. 3 LDO Regulator Specifications .................................................... 4 VCOM Amplifier Specifications .................................................... 5 Gate Pulse Modulator Specifications ......................................... 6 General Specifications ................................................................. 6 Absolute Maximum Ratings............................................................ 7 ESD Caution.................................................................................. 7 Pin Configuration and Function Descriptions............................. 8 Typical Performance Characteristics ............................................. 9 Theory of Operation ...................................................................... 12 Current-Mode, Step-Up Switching Regulator Operation..... 12 VCOM Amplifier ........................................................................... 16 Gate Pulse Modulator Circuit................................................... 16 Power-Up Sequence ................................................................... 17 Shutdown..................................................................................... 17 UVLO........................................................................................... 17 Power Dissipation....................................................................... 18 Layout Guidelines....................................................................... 19 Typical Application Circuits ......................................................... 20 Outline Dimensions ....................................................................... 25 Ordering Guide .......................................................................... 25
REVISION HISTORY
4/05--Revision 0: Initial Version
Rev. 0 | Page 2 of 28
ADD8754 SPECIFICATIONS
STEP-UP SWITCHING REGULATOR SPECIFICATIONS
VIN_1 = VIN_2 = SHDN = 5 V, VOUT1 = VDD_1 = VDD_2 = 14 V, TA = 25C, FREQ = GND, unless otherwise noted. Table 1.
Parameter SUPPLY Input Voltage Range OUTPUT 1 Output Voltage Range Load Regulation Line Regulation Load Regulation Line Regulation Overall Regulation REFERENCE Feedback Voltage ERROR AMPLIFIER Transconductance Gain Input Bias Current SWITCH On Resistance Leakage Current Peak Current Limit OSCILLATOR Oscillator Frequency Maximum Duty Cycle SOFT START Peak Current
1
Symbol VIN VOUT1
Conditions
Min 3.0
Typ
Max 5.5 20
Unit V V V/mA mV V/mA mV % V A/V V/V nA m A A kHz MHz % A
10 mA ILOAD 150 mA, VOUT1 = 10 V ILOAD = 350 mA, 4.5 V VIN_1 5.5 V 10 mA ILOAD 150 mA, VOUT1 = 10 V ILOAD = 150 mA, 3.0 V VIN_1 5.5 V Line, load, temperature (-40C TA +85C) VFB GMEA AV IB RDS (ON) ILKG ICL FOSC DMAX
200 200 -3 1.200 1.211 100 1000 225 170 0.5 2.6 650 1.2 90 2.5 +3 1.220
VLX = 14 V, SHDN = GND
FREQ = GND FREQ = VIN_1 VFB = 1 V SS = GND
95
Refer to the Figure 23.
Rev. 0 | Page 3 of 28
ADD8754
LDO REGULATOR SPECIFICATIONS
VIN_1 = VIN_2 = SHDN = 5 V, ADJ = LDO_OUT, 1 CLDO = 2.2 F, TA = 25C, unless otherwise noted. Table 2.
Parameter INPUT Input Voltage Range Symbol VIN 2 Conditions ADJ = LDO_OUT1 ADJ = OPEN 3 ADJ = GND OUTPUT Output Voltage LDO_OUT ILDO = 1 mA, ADJ = GND ILDO = 350 mA, ADJ = GND ILDO = 1 mA, ADJ = OPEN ILDO = 350 mA, ADJ = OPEN ILDO = 1 mA, ADJ = LDO_OUT ILDO = 350 mA, ADJ = LDO_OUT Voltage Accuracy Line Regulation Load Regulation Dropout Voltage Current Limit
1 2
Min 3.0 3.35 3.8
Typ
Max 5.5 5.5 5.5
Unit V V V
4
3.31 3.29 2.86 2.84 2.51 2.49 -3 3 20 300 350 500 +3
V V V V V V % mV/V mV mV mA
ILDO = 1 mA to 350 mA, -40C TA +85C ILDO = 1 mA ILDO = 1 mA to 350 mA VDROP ILDPK LDO_OUT = 98% of LDO_OUT(NOM), ILDO = 350 mA
Sets LDO_OUT(NOM) to 2.5 V. VIN = VIN_1 = VIN_2. 3 Sets LDO_OUT(NOM) to 2.85 V. 4 Sets LDO_OUT(NOM) to 3.3 V.
Rev. 0 | Page 4 of 28
ADD8754
VCOM AMPLIFIER SPECIFICATIONS
VIN_1 = VIN_2 = SHDN = 5 V, VDD_2 = 14 V, POS = 4.0 V, NEG = OUT, TA = 25C, unless otherwise noted. Table 3.
Parameter INPUT CHARACTERISTICS Offset Voltage Noninverting Input Bias Current Input Voltage Range Common-Mode Rejection Ratio OUTPUT CHARACTERISTICS Output Voltage Swing Output Current 1 POWER SUPPLY Supply Voltage Power Supply Rejection Ratio Supply Current DYNAMIC PERFORMANCE Slew Rate 2 Gain Bandwidth
1 2
Symbol VOS IB
Conditions
Min
Typ 19 50
Max
Unit mV nA V dB V mV mA
300 VDD_2 - 3
2 CMRR VOH VOL IOUT VDD_2 PSRR ISY SR GBW 8 65 VCM = 2 V to (VDD_2 - 3) V IOUT (source) = 50 mA IOUT (sink) = 50 mA 60 VDD_2 - 0.5 50 300
18 70 2 105 1.95
7.5 V VDD_2 18.5 V No load, POS = VDD_2 /2 RL = 10 k, CL = 10 pF -3 dB, RL = 10 k, CL = 10 pF
V dB mA V/s MHz
Not short-circuit protected. Slew rate is the average of the rising and the falling slew rates.
Rev. 0 | Page 5 of 28
ADD8754
GATE PULSE MODULATOR SPECIFICATIONS
VIN_1 = VIN_2 = SHDN = 5 V, VGH = 20 V, VDD_1 = 14 V, TA = 25C, unless otherwise noted. Table 4.
Parameter INPUT CHARACTERISTICS VGH Voltage VGH Input Current VDD_1 Voltage VDD_1 Input Current CONTROL INPUT CHARACTERISTICS VFLK Voltage Low VFLK Voltage High VFLK Input Current VDPM Voltage Low VDPM Voltage High VDPM Input Current SWITCHING CHARACTERISTICS VGH to VGH_M On Resistance VGH_M Discharge Current 1 DELAY CHARACTERISTICS Delay Time 2
1 2
Symbol VGH IVGH IVDD_1 VLOWFLK VHIGHFLK IFLK VLOWDPM VHIGHDPM IVDPM RVGH IVGH_M TDELAY
Condition
Min 7
Typ
Max 30
Unit V A V A
VFLK = GND, VDPM = LDO_OUT 7 VFLK = VDPM = LDO_OUT
95 VGH 0.02 0.8
0.9 VFLK LDO_OUT
2.2 -1 2.2 -1 60 8.0 1.88
+1 0.8 +1
0.9 VDPM LDO_OUT VDPM = VFLK = LDO_OUT VFLK < 0.8 V, RE = 33 k CE = 470 pF, RE = 33 k
V V A V V A mA s
Discharge current = 302.5/(RE + 5000). Delay time = CE x 4200.
GENERAL SPECIFICATIONS
VIN_1 = VIN_2 = SHDN = 5 V, TA = 25C, unless otherwise noted. Table 5.
Parameter SHUTDOWN Input Voltage Low Input Voltage High Shutdown Pin Input Current Total Ground Current Total VIN Current (IVIN_1 + IVIN_2) UNDERVOLTAGE LOCKOUT UVLO Rising Threshold UVLO Falling Threshold QUIESCENT CURRENT Step-Up Regulator in Nonswitching State Step-Up Regulator in Switching State Symbol VIL VIH GND SHDN 5.5 V SHDN = GND SHDN = GND VUVLOR VUVLOF IQ IQSW VIN_1 rising VIN_1 falling -1 2.8 2.6 300 2 500 3 2.2 -1 2.0 +1 +1 Conditions Min Typ Max 0.8 Unit V V A A A V V A mA
Rev. 0 | Page 6 of 28
ADD8754 ABSOLUTE MAXIMUM RATINGS
TA= 25C, unless otherwise noted. Table 6.
Parameter RE, CE, FB, SHDN, VIN_2, FREQ, COMP, SS, VIN_1, LDO_OUT, ADJ, VDPM, VFLK to GND, PGND, and AGND OUT, NEG and POS to GND, PGND, and AGND LX to GND, PGND, and AGND VDD_2 and OUT to GND, PGND, and AGND Voltage Between GND and AGND, GND and PGND, and AGND and PGND VDD_1, VGH, and VGH_M to GND, PGND, and AGND Differential Voltage Between POS and NEG Package Power Dissipation Thermal Resistance Maximum Junction Temperature Operating Temperature Range Storage Temperature Range Reflow Peak Temperature (20 sec to 40 sec) Symbol Rating -0.5 V to +6.5 V
-0.5 V to +16 V -0.5 V to +22 V -0.5 V to +18.5 V 0.5 V
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Absolute maximum ratings apply individually only, not in combination.
-0.5 V to +32 V 5 V PD JA TJ max TA TS (TJ max - TA)/JA 38C/W 125C -40C to +85C -65C to +150C 250C
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
Rev. 0 | Page 7 of 28
ADD8754 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
PGND
24 23 22 21 20 19
GND 1 VGH_M 2 VFLK
3
SHDN
18 17
VGH
RE
CE
FB
LX VIN_2 FREQ COMP SS VIN_1
ADD8754
TOP VIEW (Not to Scale)
16 15 14 13
VDPM 4 VDD_1 5 VDD_2 6
7
8
9
10
11
12
NEG
POS
OUT
LDO_OUT
AGND
ADJ
Figure 2. Pin Configuration
Table 7. Pin Function Descriptions
Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 Mnemonic GND VGH_M VFLK VDPM VDD_1 VDD_2 OUT NEG POS AGND ADJ LDO_OUT VIN_1 SS COMP FREQ VIN_2 LX SHDN FB PGND CE RE VGH Description Ground. Gate Pulse Modulator Output. This pin supplies the gate drive signal. Gate Pulse Modulator Control Input. Gate Pulse Modulator Enable. VGH_M is enabled when the voltage on this pin is more than 2.2 V. VGH_M goes to GND when this pin is connected to GND. Gate Pulse Modulator Low Voltage Input. VCOM Amplifier Supply. VCOM Amplifier Output. Inverting Input of VCOM Amplifier. Noninverting Input of VCOM Amplifier. Analog Ground. LDO Output Voltage Select. Refer to Table 13 for details. LDO Output. Supply Input. This pin supplies power to the LDO and step-up switching regulator. Typically connected to VIN_2. Soft Start. A capacitor must be connected between GND and this pin to set the soft start time. Compensation for the Step-Up Converter. A capacitor and resistor are connected in series between GND and this pin for stable operation. Frequency Select. Set the switching frequency with a logic level. The step-up switching regulator operates at 650 kHz when this pin is connected to GND and at 1.2 MHz when connected to VIN_1. Step-Up Switching Regulator Power Supply. This pin supplies power to the driver for the switch. Typically connected to VIN_1. Step-Up Switching Regulator Switch Node. Device Shutdown Pin. This pin allows users to shut the device off when connected to GND. The normal operating mode is to pull this pin to VIN_1. Feedback Voltage Sense to Set the Output Voltage of the Step-Up Switching Regulator. Step-Up Switching Regulator Power Ground. GPM Time Delay. A capacitor must be connected between GND and this pin to set the delay time. GPM Negative Ramp Rate. A resistor must be connected between GND and this pin to set the negative ramp rate. Gate Pulse Modulator High Voltage Input.
Rev. 0 | Page 8 of 28
05110-002
ADD8754 TYPICAL PERFORMANCE CHARACTERISTICS
100 FREQ = GND 90 80 FREQ = VIN VIN = 5V VOUT = 10V
2.90 2.85 ADJ = OPEN 2.80
OUTPUT VOLTAGE (V)
70 60 50 40 30 20
2.75 2.70 2.65 2.60 2.55
05110-049
10 0 1 10 ILOAD (mA) 100
2.50 2.45
1k
0
50
100
150
200
250
300
350
400
LOAD CURRENT (mA)
Figure 3. Efficiency vs. Load Current (mA)
Figure 6. LDO Output Voltage vs. Load Current, VIN = 3.3 V
3.4
T
3.3 ADJ = GND
OUTPUT VOLTAGE (V)
1
CH1 = VOUT 5V/DIV CH2 = IL 1A/DIV CH3 = SD 5V/DIV
VIN = 5V VOUT = 10V IOUT = 200mA CSS = 0F
3.2
3.1
3.0
2
2.9
05110-026
2.8
0
50
100
150
200
250
300
350
400
3
LOAD CURRENT (mA)
Figure 4. Start-Up Response from Shutdown, CSS = 0 F
Figure 7. LDO Output Voltage vs. Load Current, VIN = 5 V
6
T
5 4 SD PIN 2.2F OUTPUT CAP 750nF OUTPUT CAP 10F OUTPUT CAP
05110-052
VOLTS (V)
1
CH1 = VOUT 5V/DIV CH2 = IL 1A/DIV CH3 = SD 5V/DIV
VIN = 5V VOUT = 10V IOUT = 200mA CSS = 10nF
3 2
1 0
05110-027
2
-1 -80
-40
0
40
80
120
160
200
240
280
3
TIME (s)
Figure 5. Start-Up Response from Shutdown, CSS = 10 F
Figure 8. LDO Power-Up Response from Shutdown
Rev. 0 | Page 9 of 28
05110-051
ADJ = OPEN
05110-050
ADJ = LDO_OUT
ADD8754
6
3.32
5 SD PIN 750nF OUTPUT CAP
T
LOAD STEP FROM 30k TO 10 ADJ = GND
4
VOLTS (V)
3.30 VOUT (V) 3.28 3.26
3
2 2.2F OUTPUT CAP
VOUT = 20mV/DIV
1 0 -1 -80
05110-053
10F OUTPUT CAP -40 0 40 80 120 160 200 240
400 ILOAD (mA) IOUT = 200mA/DIV 0
05110-056
200
280
TIME (s)
Figure 9. LDO Power-Up Response from Shutdown
Figure 12. LDO Load Transient Response, VOUT = 3.3 V
6
5 SD PIN
T
VIN HIGH = 5.5V VIN (V)
4
VOLTS (V)
3
VIN LOW = 3.8V
2 750nF OUTPUT CAP 2.2F OUTPUT CAP
4V 3V VOUT (V)
05110-054
1 0
10F OUTPUT CAP -40 0 40 80 120 160 200 240
2V ADJ = GND
05110-057
-1 -80
280
1V
TIME (s)
Figure 10. LDO Power-Up Response from Shutdown
Figure 13. LDO Line Transient Response, VOUT = 3.3 V
2.52 ADJ = LDO_OUT 2.50 VOUT (V) 2.48 2.46 VOUT = 20mV/DIV
T
VIN HIGH = 5.5V VIN (V) VIN LOW = 3.8V
300 200 ILOAD (mA)
05110-055
4V 3V 2.5V 2V VOUT (V) 1V
100 IOUT = 100mA/DIV 0 100s
ADJ = LDO_OUT
05110-058
Figure 11. LDO Load Transient Response, VOUT = 2.5 V
Figure 14. LDO Line Transient Response, VOUT = 2.5 V
Rev. 0 | Page 10 of 28
ADD8754
5.0
T
: 8.00V @: 5.04V : 102ns @: -83.2ns
4.5 4.0 3.5
DELAY TIME (s)
3.0 2.5 2.0
0k
5k 10k
1.5 1.0
05110-059
50k
25k
05110-061
0.5 0 0 100 200 300 400 500 600
1
Ch1
2.00 V
M 40.0ns
A Ch1
12.0 V
700
CAPACITANCE CE (pF)
Figure 15. VCOM Rising Slew Rate, VDD_2 = 14 V
Figure 17. GPM Delay Time vs. CE Capacitance
T
: 8.08V @: 9.08V : 60.8ns @: 1.88s
1
Ch1
2.00 V
M 40.0ns
A Ch1
5.16 V
Figure 16. VCOM Falling Slew Rate, VDD_2 = 14 V
05110-060
Rev. 0 | Page 11 of 28
ADD8754 THEORY OF OPERATION
COMP SS VIN_1 VIN_2
ADD8754
REF gm FB SLOPE COMP FREQ SHDN UVLO AND THERMAL PROTECTION VIN_1 VDD_2 ADJ AGND VDD_2 POS OUT AGND GATE HIGH MOD. CIRCUIT
05110-048
BIAS F/F R Q S LX
A 20 nF soft start capacitor results in negligible input-current overshoot at startup, making it suitable for most applications. However, if an unusually large output capacitor is used, a longer soft start period is required to prevent large input inrush current. Table 8. Typical Soft Start Period
VIN (V) 3.3 3.3 3.3 3.3 5 5 5 5 VOUT (V) 9 9 12 12 9 9 12 12 COUT (F) 10 10 10 10 10 10 10 10 CSS (nF) 20 100 20 100 20 100 20 100 tSS (ms) 2.5 8.2 3.5 15 0.4 1.5 0.62 2
OSC
PGND
LDO_OUT
REF
GND
VCOM NEG
On/Off Control
The SHDN input turns the ADD8754 on or off. When the stepup dc-to-dc converter is turned off, there is a dc path from the input to the output through the inductor and output diode. This causes the output voltage to remain slightly below the input voltage by the forward voltage of the diode, preventing the output voltage from dropping to zero when the regulator is shut down. See Figure 25 for the typical application circuit to disconnect the output voltage from the input voltage at shutdown.
VGH VGH_M VDD_1 CE
RE
VFLK VDPM
Figure 18. Detailed Functional Block Diagram
CURRENT-MODE, STEP-UP SWITCHING REGULATOR OPERATION
The ADD8754 uses current mode to regulate the output voltage. This current-mode regulation system allows fast transient response while maintaining a stable output voltage. By selecting the proper resistor-capacitor network from COMP to GND, the regulator response can be optimized for a wide range of input voltages, output voltages, and load conditions.
Setting the Output Voltage
The ADD8754 features an adjustable output voltage range of (VIN + 2 V) to 20 V. The output voltage is set by the resistive voltage divider from the output voltage (VOUT) to the 1.21 V feedback input at FB. Use the following formula to determine the output voltage: VOUT = 1.21 V x (1 + R1/R2) (1)
Frequency Selection
The ADD8754's frequency is user-selectable to operate either at 650 kHz to optimize the regulator for high efficiency or at 1.2 MHz for small external components. Connect FREQ to VIN_2 for 1.2 MHz operation, or connect FREQ to GND for 650 kHz operation.
Use an R2 resistance of 10 k or less to prevent output voltage errors due to the 10 nA FB input bias current. Choose R1 based on the following formula:
Soft Start Capacitor
The voltage at SS ramps up slowly by charging the soft start capacitor (CSS) with an internal 2.5 A current source. Table 8 lists the values for the soft start period based on maximum output current and maximum switching frequency. The soft start capacitor limits the rate of voltage rise on the COMP pin, which in turn limits the peak switch current at startup. Table 8 shows a typical soft start period, tSS, at the maximum output current, IOUT_MAX, for several conditions.
V - 1.21 V R1 = R2 x OUT 1.21 V For example, R1 = 75.8 k

with VOUT = 10 V and R2 = 10 k
(2)
Rev. 0 | Page 12 of 28
ADD8754
Inductor Selection
The inductor is an integral part of the step-up converter. It stores energy during the switch-on time and transfers that energy to the output through the output diode during the switch-off time. Use inductance in the range of 1 H to 22 H. In general, lower inductance values have higher saturation current and lower series resistance for a given physical size. However, lower inductance results in higher peak current, which can lead to reduced efficiency and greater input and/or output ripple and noise. Peak-to-peak inductor ripple current at close to 30% of the maximum dc input current typically yields an optimal compromise. For determining the inductor ripple current, the input (VIN) and output (VOUT) voltages determine the switch duty cycle (D) by the following equation: D=
VOUT - V IN VOUT
The inductor ripple current (IL) in steady state is IL =
V IN x t ON L
(5)
Solving for the inductance value, L,
L=
V IN x t ON
I L
(6)
Make sure that the peak inductor current (the maximum input current plus half of the inductor ripple current) is less than the rated saturation current of the inductor. In addition, ensure that the maximum rated rms current of the inductor is greater than the maximum dc input current to the regulator. For duty cycles greater than 50% that occur with input voltages greater than half the output voltage, slope compensation is required to maintain stability of the current-mode regulator. For stable current-mode operation, ensure that the selected inductance is equal to or greater than LMIN:
L > L MIN = VOUT - V IN 1.8 A x f SW (7)
(3)
Using the duty cycle and switching frequency, fSW, determine the on time by using the following equation:
tON =
D f SW
(4)
Table 9. Inductor Manufacturers
Vendor Sumida www.sumida.com Part CMD4D11-2R2MC CMD4D11-4R7MC CDRH4D28-100 CDRH5D18-220 CR43-4R7 CR43-100 DS1608-472 DS1608-103 D52LC-4R7M D52LC-100M L (H) 2.2 4.7 10 22 4.7 10 4.7 10 4.7 10 Max DC Current 0.95 0.75 1.00 0.80 1.15 1.04 1.40 1.00 1.14 0.76 Max DCR (m) 116 216 128 290 109 182 60 75 87 150 Height (mm) 1.2 1.2 3.0 2.0 3.5 3.5 2.9 2.9 2.0 2.0
Coilcraft www.coilcraft.com Toko www.tokoam.com
Rev. 0 | Page 13 of 28
ADD8754
Choosing the Input and Output Capacitors
The ADD8754 requires input and output bypass capacitors to supply transient currents while maintaining a constant input and output voltage. Use a low effective series resistance (ESR) 10 F or greater input capacitor to prevent noise at the ADD8754 input. Place the capacitors between VIN_1, VIN_2, and GND and as close as possible to the ADD8754. Ceramic capacitors are preferred because of their low ESR characteristics. Alternatively, use a high value, medium ESR capacitor in parallel with a 0.1 F low ESR capacitor as close as possible to the ADD8754. The output capacitor maintains the output voltage and supplies current to the load while the ADD8754 switch is on. The value and characteristics of the output capacitor greatly affect the output voltage ripple and stability of the regulator. Use a low ESR output capacitor; ceramic dielectric capacitors are preferred. For very low ESR capacitors such as ceramic capacitors, the ripple current due to the capacitance is calculated as follows. Because the capacitor discharges during the on time, tON, the charge removed from the capacitor, QC, is the load current multiplied by the on time. Therefore, the output voltage ripple (VOUT) is
VOUT =
Diode Selection
The output diode conducts the inductor current to the output capacitor and load while the switch is off. For high efficiency, minimize the forward voltage drop of the diode. Schottky diodes are recommended. However, for high voltage, high temperature applications, where the Schottky diode reverse leakage current becomes significant and can degrade efficiency, use an ultrafast junction diode. The diode must be rated to handle the average output load current. Many diode manufacturers derate the current capability of the diode as a function of the duty cycle. Verify that the output diode is rated to handle the average output load current with the minimum duty cycle. The minimum duty cycle of the ADD8754 is D MIN = VOUT - V IN _ MAX VOUT (12)
where VIN_MAX is the maximum input voltage. For example, DMIN = 0.45 when VOUT = 10 V and VIN_MAX = 5.5 V
Table 11. Schottky Diode Manufacturers
Vendor ON Semiconductor Diodes, Inc. Central Semiconductor Corp. Sanyo Web Address www.onsemi.com www.diodes.com www.centralsemi.com www.sanyovideo.com
QC C OUT
=
I L x t ON C OUT
(8)
where: COUT is the output capacitance. IL is the average inductor current. D t ON = f SW V - V IN D = OUT VOUT
Loop Compensation
(9) (10) Use of external components to compensate the regulator loop allows optimization of the loop dynamics for a given application. A step-up converter produces an undesirable right-half plane zero in the regulation feedback loop. This requires compensating the regulator such that the crossover frequency occurs well below the frequency of the right-half plane zero. The right-half plane zero is determined by the following equation:
V FZ (RHP ) = IN V OUT R x LOAD 2 x L
2
Choose the output capacitor based on the following equation: C OUT I L x (VOUT - V IN ) f SW x VOUT x VOUT (11)
(13)
Table 10. Capacitor Manufacturers
Vendor AVX Murata Sanyo Taiyo Yuden Web Address www.avxcorp.com www.murata.com www.sanyovideo.com www.t-yuden.com
where: FZ(RHP) is the right-half plane zero. RLOAD is the equivalent load resistance, or the output voltage divided by the load current.
Rev. 0 | Page 14 of 28
ADD8754
To stabilize the regulator, make sure that the regulator crossover frequency is less than or equal to one-fifth of the right-half plane zero and less than or equal to one-fifteenth of the switching frequency. The regulator loop gain is
AVL V V = FB x IN x G MEA x Z COMP x G CS x Z OUT VOUT VOUT
For VFB = 1.21 V, GMEA = 100 s, and GCS = 2 sec,
RC = 2.55 x 10 4 x f C x C OUT x VOUT x VOUT V IN
(17)
(14)
Once the compensation resistor is known, set the zero formed by the compensation capacitor and resistor to one-fourth of the crossover frequency, or
CC = 2 x f C x RC
where: AVL is the loop gain. VFB is the feedback regulation voltage, 1.210 V. VOUT is the regulated output voltage. VIN is the input voltage. GMEA is the error amplifier transconductance gain. ZCOMP is the impedance of the series RC network from COMP to GND. GCS is the current sense transconductance gain (the inductor current divided by the voltage at COMP), which is internally set by the ADD8754. ZOUT is the impedance of the load and output capacitor. To determine the crossover frequency, it is important to note that at that frequency the compensation impedance (ZCOMP) is dominated by the resistor and the output impedance (ZOUT) is dominated by the impedance of the output capacitor. Therefore, when solving for the crossover frequency, (by definition of the crossover frequency) the equation is simplified to
AVL = V VFB 1 x IN x GMEA x RC x GCS x =1 VOUT VOUT 2 x f C x COUT
(18)
where CC is the compensation capacitor.
ERROR AMP REF GMEA FB RC CC
05110-007
C2
Figure 19. Compensation Components
The capacitor C2 is chosen to cancel the zero introduced by output capacitance ESR. Solving for C2, C2 = ESR x C OUT RC (19)
(15)
where: fC is the crossover frequency. RC is the compensation resistor. Solving for RC, RC = 2 x f C x C OUT x VOUT x VOUT V FB x V IN x G MEA x G CS (16)
For low ESR output capacitance, such as with a ceramic capacitor, C2 is optional. For optimal transient performance, the RC and CC might need to be adjusted by observing the load transient response of the ADD8754. For most applications, the compensation resistor should be in the range of 30 k to 400 k, and the compensation capacitor should be in the range of 100 pF to 1.2 nF. Table 12 shows external component values for several applications.
Table 12. Recommended External Components for Various Input/Output Voltage Conditions
VIN (V) 5 5 5 5 3.3 3.3 3.3 3.3 VOUT (V) 9 9 12 12 9 9 12 12 fSW 650 kHz 1.2 MHz 650 kHz 1.2 MHz 650 kHz 1.2 MHz 650 kHz 1.2 MHz L (H) 10 4.7 10 4.7 10 4.7 10 4.7 COUT (F) 10 10 10 10 10 10 10 10 CIN (F) 10 10 10 10 10 10 10 10 R1 (k) 63.4 63.4 88.7 88.7 63.4 63.4 88.7 88.7 R2 (k) 10 10 10 10 10 10 10 10 RC (k) 84.5 178 140 300 71.5 150 130 280 Cc (pF) 390 100 220 100 820 180 420 100 IOUT_MAX (mA) 450 450 350 350 350 350 250 250
Rev. 0 | Page 15 of 28
ADD8754
VCOM AMPLIFIER
The output of the VCOM amplifier is designed to control the voltage on the VCOM plane of the LCD display. The VCOM amplifier is designed to source and sink the capacitive pulse current and ensure stable operation with high load capacitance. The delay capacitance in farad is calculated using the following equation: CE = (Delay Time) x 0.000238 The RE in ohms is calculated using the following equation:
RE =
Input Overvoltage Protection
Whenever the input exceeds the supply voltage, attention must be paid to the input overvoltage characteristics. When an overvoltage occurs, the amplifier can be damaged, depending on the voltage level and the magnitude of the fault current. When the input voltage exceeds the supply voltage by more than 0.6 V, the internal pin junctions allow current to flow from the input to the supplies. This input current is not inherently damaging to the device, provided it is 5 mA or less.
(Slew Rate x Load Capacitance ) - 5000
302
When the voltage on the VDPM pin is less than the turn-on threshold value, the CE pin is internally connected to GND to discharge the delay capacitor.
VIN_1 VDPM VFLK
GATE HIGH MOD. CIRCUIT VGH S1 VGH_M S3 S2 GND VDD_1 CL
Short-Circuit Output Conditions
The VCOM amplifier does not have internal short-circuit protection circuitry. As a precaution, do not short the output directly to the positive power supply or to the ground.
L O G I C
GATE PULSE MODULATOR CIRCUIT
The gate pulse modulator is used for LCD applications in which shaping of the gate high voltage signal improves image quality. A charge pump is used to generate the on voltage, VGH. A lower gate voltage level, VDD_1, is desired during the last portion of the gate's on time and is provided by VOUT. The integrated gate pulse modulator circuit provides control over the slope and delay of the transition between these two TFT on-voltage levels. The gate pulse modulator circuit has four input pins (VGH, VDD_1, VDPM, and VFLK) and one output pin (VGH_M). VFLK is a digital control signal, usually provided by the timing controller, whose high or low level determines which of the two input voltages, VGH or VDD_1, is passed through to VGH_M. The gate high modulator circuit becomes active when the voltage on pin VDPM exceeds the turn-on threshold value of 2.2 V. When the control voltage VFLK switches from logic low to logic high during normal operation with VDPM at logic high (see Figure 21), the output voltage VGH_M transitions from VDD_1 to VGH. When the control voltage VFK switches from logic high to logic low, the output voltage VGH_M transitions from VGH to VDD_1 after a time delay determined by the size of a capacitor from the CE pin to the GND and a slew rate determined by the size of resistor from the RE pin to the GND.
S4 GND REF
VOUT/VGH
GND
Figure 20. Gate Pulse Modulator Functional Block Diagram
ENABLE - VDPM LOW SLOPE CONTROLLED BY RE CONTROL SIGNAL - VFLK LOW T1 OUTPUT SIGNAL - VGH_M WITH LOAD CAPACITANCE CL LOW
05110-009
T2 VGH VDD_1
T1 DELAY CONTROLLED BY CE
T2
Figure 21. Gate Pulse Modulator Timing Diagram
Rev. 0 | Page 16 of 28
05110-008
DELAY CAPACITOR
CE
RAMP RESISTOR
RE
ADD8754
POWER-UP SEQUENCE
Most LCD panels require that when VIN is applied, LDO_OUT, VGL, BOOST_OUT, VGH, and VGH_M are established sequentially, as indicated in Figure 22. ADD8754 provides this sequence with appropriate capacitors for the VGL and VGH charge pumps.
VIN
LDO Input Capacitor Selection
For the input voltage of the ADD8754 LDO regulator (VIN_1), a local bypass capacitor is recommended. The input capacitor provides bypassing for the internal amplifier used in the voltage regulation loop. Use at least a 1 F low ESR capacitor. Larger input capacitance and lower ESR provide better supply noise rejection. Multilayer ceramic chip (MLCC) capacitors provide the best combination of low ESR and small size.
LDO Output Capacitor Selection
SHDN SHDN THRESHOLD LEVEL
VDPM
VGH
VGH_M
The output capacitor improves the regulator response to sudden load changes. The output capacitor helps determine the performance of any LDO. The ADD8754 LDO requires at least a 2.2 F capacitor. Transient response is a function of output capacitance, in that larger values of output capacitance decrease peak deviations, providing improved transient response for large load current changes. Choose the capacitors by comparing their lead inductance, ESR, and dissipation factor. Output capacitance affects stability, and a larger cap provides a greater phase margin for the ADD8754 LDO. MLCC capacitors provide the best combination of low ESR and small size. Note that the capacitance of some capacitor types show wide variations over temperature. A good quality dielectric X7R or better capacitor is recommended.
LDO_OUT BOOST_OUT
05110-010
VGL
Figure 22. Power-Up Sequence Timing Diagram
LDO Regulator
The ADD8754 low dropout (LDO) regulator has three preset output voltage settings. As shown in Table 13, by tying the ADJ pin low, a 3.3 V nominal output is selected. By tying ADJ to the output voltage, a 2.5 V nominal output is selected. By leaving ADJ as an open circuit, a nominal voltage of 2.85 V is selected.
Table 13. LDO Output Voltage Selection
LDO Output Voltage 2.5 V 2.85 V 3.3 V ADJ Pin LDO_OUT No connection GND
SHUTDOWN
Applying a TTL high signal to the shutdown pin (tying it to the VIN_1) turns on all outputs. Pulling SHDN down to 0.4 V or below (tying it to GND) turns off all outputs. In shutdown mode, quiescent current is reduced to a typical value of 300 A.
UVLO
An undervoltage lockout (UVLO) circuit is included with a built in hysteresis. ADD8754 turns on when VIN_1 rises above 2.8 V and shuts down when VIN_1 falls below 2.6 V.
Rev. 0 | Page 17 of 28
ADD8754
POWER DISSIPATION
The ADD8754's maximum power dissipation depends on the thermal resistance from the IC die to the ambient environment and the ambient temperature. The thermal resistance depends on the IC package, PC board copper area, other thermal mass, and airflow. The ADD8754, with the exposed backside pad soldered to a 2-layer PC board with nine 12 mil-diameter thermal vias, can dissipate about 1.5 W into 65C still air before the die exceeds 125C. More PC board copper, cooler ambient air, and more airflow increase the dissipation capability, whereas less copper or warmer air decreases the IC's dissipation capability. The major contributors to the power dissipation are the LDO regulator and the VCOM amplifier.
VCOM Amplifier
The power dissipated in the VCOM amplifier depends on the output current, the output voltage, and the supply voltage: PDSOURCE = IOUT (source) x (VDD_2 - VOUT) PDSINK = IOUT (sink) x VOUT where: IOUT (source) is the output current sourced by the VCOM amplifier. IOUT (sink) is the output current that the VCOM amplifier sinks to AGND. In a typical case where the supply voltage is 12 V and the output voltage is 6 V with an output source current of 20 mA, the power dissipated is 120 mW.
Step-Up Converter
The largest portions of power dissipation in the step-up converter are the internal MOSFET, the inductor, and the output diode. For a 90% efficiency step-up converter, about 3% to 5% of the power is lost in the internal MOSFET, about 3% to 4% in the inductor, and about 1% in the output diode. The rest of the 1% to 3% is distributed among the input and output capacitors and the PC board traces. For an input power of about 3 W, the power lost in the internal MOSFET is about 90 mW to 150 mW.
Thermal Overload Protection
Thermal overload protection prevents excessive power dissipation from overheating the ADD8754. When the junction temperature exceeds TJ = 145C, a thermal sensor immediately activates the fault protection, which shuts down the device, allowing the IC to cool. The device self-starts once the die temperature falls below TJ = 105C. Thermal overload protection protects the controller in the event of fault conditions. For continuous operation, do not exceed the absolute maximum junction temperature rating of TJ = 125C.
LDO
The power dissipated in the LDO depends on the output current, the output voltage, and the supply voltage: PDLDO = (VIN_1 - LDO_OUT) x ILDO_OUT
Rev. 0 | Page 18 of 28
ADD8754
LAYOUT GUIDELINES
When designing a high frequency, switching, regulated power supply, layout is very important. Using a good layout can solve many problems associated with these types of supplies. Some of the main problems are loss of regulation at high output current and/or large input-to-output voltage differentials, excessive noise on the output and switch waveforms, and instability. Using the following guidelines can help minimize these problems. Make all power (high current) traces as short, direct, and thick as possible. It is good practice on a standard PCB board to make the traces an absolute minimum of 15 mil (0.381 mm) per Ampere. The inductor, output capacitors, and output diode should be as close to each other as possible. This helps reduce the EMI radiated by the power traces that is due to the high switching currents through them. This also reduces lead inductance and resistance, which in turn reduce noise spikes, ringing, and resistive losses that produce voltage errors. The grounds of the IC, input capacitors, output capacitors, and output diode (if applicable), should be connected close together, directly to a ground plane. It is also a good idea to have a ground plane on both sides of the printed circuit board (PCB). This reduces noise by reducing ground-loop errors and absorbing more of the EMI radiated by the inductor. For multilayer boards of more than two layers, a ground plane can be used to separate the power plane (power traces and components) and the signal plane (feedback, compensation, and components) for improved performance. On multilayer boards, the use of vias is required to connect traces and different planes. If a trace needs to conduct a significant amount of current from one plane to the other, it is good practice to use one standard via per 200 mA of current. Arrange the components so that the switching current loops curl in the same direction. Due to the how switching regulators operate, there are two power states: one state when the switch is on, and one when the switch is off. During each state, there is a current loop made by the power components currently conducting. Place the power components so that the current loop is conducting in the same direction during each of the two states. This prevents magnetic field reversal caused by the traces between the two half cycles and reduces radiated EMI.
Layout Procedure
To achieve high efficiency, good regulation, and stability, a good PCB layout is required. It is recommended that the reference board layout be followed as closely as possible because it is already optimized for high efficiency and low noise. Use the following general guidelines when designing PCBs: 1. 2. 3. 4. 5. Keep CIN close to the IN and GND leads of the ADD8754. Keep the high current path from CIN (through L1) to the SW and PGND leads as short as possible. Keep the high current path from CIN (through L1), D1, and COUT as short as possible. Keep high current traces as short and wide as possible. Keep nodes connected to SW away from sensitive traces such as FB or COMP to prevent coupling of the traces. If these traces need to be run near each other, place a ground trace between the two as a shield. Place the feedback resistors as close as possible to the FB pin to prevent noise pickup. Place the compensation components as close as possible to the COMP pin. Avoid routing noise-sensitive traces near the high current traces and components. Use a thermal pad size that is the same as the dimension of the exposed pad on the bottom of the package.
6. 7. 8. 9.
Heat Sinking
When using a surface-mount power IC or external power switches, the PCB can often be used as the heat sink. This is done by simply using the copper area of the PCB to transfer heat from the device.
Rev. 0 | Page 19 of 28
ADD8754 TYPICAL APPLICATION CIRCUITS
R5 1k BAV99 D5 C3 1F D4 C2 0.1F C4 0.47F BAV99 D3 D2 C1 0.1F VZ2 BZX84C28 C7 1F
VGL -5V VZ1 BZX84C5V1
R6 300 C10 0.47F C6 0.1F
BAV99 D6 D7
C5 0.1F
R9 10 VOUT +14V
R2 9.5k RE 33k 24 VGH 23 RE 22 CE CE 390pF 21 PGND 20 FB 19 SHDN
R1 100k
D1 1N5818
COUT 20F
CSD 10F L 10H RSD 180k
1 TO GATE DRIVER VFLK +14V FROM VOUT 2 3 4 R7 250k R8 100k C8 0.1F 5 6
GND VGH_M VFLK
LX VIN_2 FREQ
18 17 16 15 14 13
VIN +5V
ADD8754
VDPM VDD_1 COMP SS VIN_1 AGND LDO_ OUT
RC 180k CSS 10nF CIN 10F CC 470pF
VDD_2
NEG
POS
OUT
7 VCOM +4.0V C9 1F
8
9
10 R3 100k
11
ADJ
+14V FROM VOUT
12 VLOGIC +3.3V CLDO 4.7F
05110-003
R4 250k
+14V FROM VOUT
Figure 23. 1.2 MHz Application Circuit for TFT LCD Panel with Charge Pumps for VGH and VGL
Rev. 0 | Page 20 of 28
ADD8754
+30V VGH CVGH 10F VZ2 1N7451A D3 1N914 RVGH 75 VOUT +12V T COUT 20F
R2 10k RE 33k 24
VGH
R1 91k
CE 390pF 21
PGND
D1 1N5818
23
RE
22
CE
20
FB
19
SHDN
RVGL 50 LX VIN_2 FREQ 18 17 16 15 14 13 CIN 10F CSS 10nF RC 180k VZ1 BZX84C5V1
D2 1N914 CVGL 0.1F
1 TO GATE DRIVER VFLK +12V FROM VOUT 2 3 4 R7 250k R8 100k C8 0.1F 5 6
GND VGH_M VFLK
VGL -5V
ADD8754
VDPM VDD_1 COMP SS VIN_1
AGND LDO_ OUT
VIN +5V
CC 470pF
VDD_2
NEG
POS
OUT
ADJ
+12V FROM VOUT 7 VCOM +4.0V C9 1F
T = TRANSTEK MAGNETICS TMS60059CS
8
9
10
11
12 VLOGIC +3.3V
05110-004
+12V FROM VOUT
CLDO 4.7F R4 R12 R3 7.5k 1k 4.7k
Figure 24. 1.2 MHz Application Circuit for TFT LCD Display with Transformer for VGH and VGL
Rev. 0 | Page 21 of 28
ADD8754
VGH +28V R5 1k BAV99 D5 C3 1F D4 C2 0.01F C4 0.47F BAV99 D3 D2 C1 0.01F
VZ2 BZX84C28
C7 1F
VGL -5V VZ1 BZX84C5V1
R6 300 C10 0.47F C6 0.1F
BAV99 D6 D7
C5 0.01F
R9 10 VOUT +14V
R2 9.5k RE 33k 24
VGH
R1 100k
CE 390pF 21
PGND
D1 1N5818
COUT 20F
23
RE
22
CE
20
FB
19
SHDN
1 TO GATE DRIVER VFLK +14V FROM VOUT 2 3 4 R7 250k R8 100k C8 0.1F 5 6
GND VGH_M VFLK
LX VIN_2 FREQ
18 17 16 15 14 13
L 10H
RSD 180k
CSD 10F
FDC6331 R10 10k VIN +5V
ADD8754
VDPM VDD_1 COMP SS VIN_1
AGND LDO_ OUT
RC 180k CSS 10nF CC 470pF
VDD_2
NEG
POS
OUT
ADJ
+14V FROM VOUT 7 VCOM +4.0V C9 1F
CIN 10F
ENABLE
8
9
10 R3 100k
11
12 VLOGIC +3.3V CLDO 4.7F
05110-005
R4 250k
+14V FROM VOUT
Figure 25. 1.2 MHz Application Circuit for TFT LCD Display with Charge Pumps with Input Power Disconnect Switch
Rev. 0 | Page 22 of 28
ADD8754
VGH +28V R5 1k BAV99 D5 C3 1F D4 C2 0.01F C4 0.47F BAV99 D3 D2 C1 0.01F
VZ2 BZX84C28
C7 1F
VGL -5V VZ1 BZX84C5V1
R6 300 C10 0.47F C6 0.1F
BAV99 D6 D7
C5 0.01F
R9 10 VOUT +14V
R2 9.5k RE 33k 24 23 22 CE 390pF 21 20 19
R1 100k
COUT 20F
PGND
SHDN
VGH
RE
CE
FB
D1 1N5818 L 10H
1 TO GATE DRIVER VFLK +14V FROM VOUT 2 3 4 R7 250k R8 100k C8 0.1F 5 6
GND VGH_M VFLK
LX VIN_2 FREQ
18 17 16 15 14 13
VIN +5V
ADD8754
VDPM VDD_1 COMP SS VIN_1
VDD_2
CSS 10nF CIN 10F
Q1 2N7000 RC 180k CC 470pF R10 10k
BOOST AND CHARGE PUMP ENABLE
AGND
7 VCOM +4.0V C9 1F
8
9
10 R3 100k
11
12 VLOGIC +3.3V CLDO 4.7F
05110-047
R4 250k
+14V FROM VOUT
Figure 26. 1.2 MHz Application Circuit for TFT LCD Display with LDO_ALWAYS_ ON
Rev. 0 | Page 23 of 28
LDO_ OUT
NEG
POS
OUT
ADJ
+14V FROM VOUT
ADD8754
ADD8754
AGND LDO_ OUT
VDD AD5259BRMZ10 RA 1k A W B R3 10k VLOGIC SCL SDA C9 0.1F R10 2.2k R11 2.2k SIGNAL FROM FACTORY PC, SOFTWARE PROVIDED BY ADI
NEG
OUT
POS
C10 2.2pF RB 6k
VOUT 14V R4 315k
VCOM 4.0V ADJUSTABLE FROM 3V TO 5V WITH 15mV PER STEP ADJUSTMENT
GND AD0 AD1
05110-006
Figure 27. ADD8754 with Programmable VCOM
ADJ
The VCOM calibration for flicker reduction is one of the essential steps in the panel manufacturing process. In a typical panel production environment, such a process can take additional time to complete and, therefore, impacts production throughput. One additional concern is that a potentiometer typically used only for calibration offers limited resolution. The resistance can drift over time and can be noticeable after a few years of operation. The production throughput, image quality, and panel reliability concerns can all be solved by using a digital potentiometer. As shown in Figure 27, AD5259, a low cost 256-step digital potentiometer with nonvolatile memory, can calibrate the ADD8754 VCOM voltage precisely, reliably, and time efficiently. In the worst case, where the temperature, aging effect, and resistance tolerance of the AD5259 are all accounted for, the circuit in Figure 27 makes the VCOM voltage adjustable from 3.0 V to 5.0 V with 15 mV per step adjustment. A micro-
controller or I2C programmer can be used to provide the control signal for the AD5259, but ADI provides programming software that simplifies the calibration process. The software can be installed in the factory computer, and two tester probes can be connected to the computer's parallel port to implement the VCOM programming. The VCOM voltage can be calculated as
D x R AB + R 3 256 = x 7 x VOUT R 4 + R AB + R 3
VCOM
where: D is the decimal code of the AD5259 programmable resistance between the W-to-B terminals. RAB is the AD5259 nominal resistance.
Rev. 0 | Page 24 of 28
ADD8754 OUTLINE DIMENSIONS
4.00 BSC SQ 0.60 MAX 0.60 MAX
19 18 EXPOSED PAD 24 1
PIN 1 INDICATOR 2.25 2.10 SQ 1.95
7 6
PIN 1 INDICATOR
TOP VIEW
3.75 BSC SQ
0.50 BSC 0.50 0.40 0.30
(BOTTOM VIEW)
13 12
0.25 MIN 2.50 REF
1.00 0.85 0.80
12 MAX
0.80 MAX 0.65 TYP
0.05 MAX 0.02 NOM 0.20 REF COPLANARITY 0.08
SEATING PLANE
0.30 0.23 0.18
COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-2
Figure 28. 24-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 4 x 4 mm Body, Very Thin Quad (CP-24-1) Dimensions shown in millimeters
ORDERING GUIDE
Model ADD8754ACPZ-REEL 1 ADD8754ACPZ-REEL71
1
Temperature Range -40C to +85C -40C to +85C
Package Description 24-Lead LFCSP_VQ 24-Lead LFCSP_VQ
Package Option CP-24-1 CP-24-1
Quantity 5,000 1,500
Z = Pb-free part.
Rev. 0 | Page 25 of 28
ADD8754 NOTES
Rev. 0 | Page 26 of 28
ADD8754 NOTES
Rev. 0 | Page 27 of 28
ADD8754 NOTES
(c)2005 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D05110-0-4/05(0)
Rev. 0 | Page 28 of 28


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